Blog về công ty Mingjiada Supplies Amphenol UE62-F162G-020G1: OSFP 1x1 Low-Profile Cage Technical Specifications

​In the selection process for 800G optical modules and high-density data center interconnects, OSFP cage assemblies are often an underestimated yet critical component that directly impacts thermal management and signal integrity. Amphenol’s UE62-F162G-020G1 is a 1x1 low-profile OSFP cage designed for the 112G PAM-4 generation, featuring a 9.5mm-high extruded heat sink and engineered specifically for high-density optical module deployments. As an electronic component distributor with a long-standing, deep partnership with the original manufacturer, Mingjiada Electronics offers genuine, in-stock supply of this model.

I. Technical Positioning of the UE62-F162G-020G1 in 800G Interconnects

The core design objective of the OSFP (Optical Sub-Plug-in) specification is to achieve higher port density and thermal efficiency within the limited space of a switch panel. The UE62-F162G-020G1 is a 1x1 low-profile cage component under this specification, rather than a transceiver module itself. Its function is to provide mechanical support, electromagnetic shielding, and thermal dissipation pathways for inserted OSFP optical modules or DAC/AOC cables.

Compared to standard-height OSFP cages, the direct benefit of the low-profile design lies in reducing the Z-axis footprint, allowing 1U switches or server panels to accommodate more ports or, with the same number of ports, improve airflow organization between the front and rear air ducts. The integration of a 9.5mm extruded heat sink represents an engineering compromise to maintain thermal headroom within the low-profile constraints: extruded aluminum profiles strike a good balance between cost, thermal conductivity, and batch consistency, making them suitable for high-volume data center deployments.

II. Core Technical Specifications at a Glance

Manufacturer: Amphenol Communications Solutions

Product Type: OSFP 1x1 Low-Profile Cage Assembly (with Heat Sink)

Package/Mounting: Plug-in, Right-Angle (Cage, Right-Angle)

Number of Ports: 1

Number of Pins: 60P

Contact Pitch: 0.60 mm

Data Rate: 112 Gb/s PAM-4 Modulation

Total Bandwidth: 800 Gb/s

Heat Sink: 9.5 mm high extruded heat sink

Operating Temperature: −55°C to +85°C

Environmental Standards: RoHS Compliant

Packaging: Tray; Approx. 76.93 g gross weight per unit

Two parameters require special attention: First, the 60P pin count refers to the physical contact specifications of this housing and is a concept distinct from the number of channels in a transceiver module; these should not be confused during selection. Second, the operating temperature range of −55°C to +85°C covers the common environmental requirements for industrial-grade and telecom-grade equipment, ensuring good adaptability in scenarios such as base stations, industrial switches, and outdoor cabinets.

III. Suitable Scenarios: Which Devices Should Prioritize This Model

The UE62-F162G-020G1’s slim-profile design combined with a 9.5mm heat sink offers clear engineering advantages in the following types of equipment:

High-density data center switches. Space on the front panel of 1U switches is extremely limited; the slim cage allows for more OSFP ports without increasing the z-axis height. Combined with the 9.5mm heat sink, it provides basic thermal management for modules such as 800G DR8/SR8 with power consumption in the 15–18W range. This model’s design—featuring a total bandwidth of 800 Gb/s and eight high-speed channels per port—perfectly matches the interconnect requirements of 800G-generation OSFP modules.

High-speed interconnects for AI/HPC clusters. The demand for inter-node bandwidth in AI servers and GPU clusters is driving the accelerated deployment of 800G OSFP. As a “passive component,” the signal integrity and thermal consistency of the cage directly impact the bit error rate performance of high-speed links. Slim-profile cages are particularly common in short-distance DAC/AOC scenarios, where the pursuit of panel density often takes precedence over the need for additional thermal space.

Telecommunications and industrial communication equipment. An operating temperature range of −55°C to +85°C enables this model to operate within a wider environmental window than commercial-grade products. For outdoor baseband units, industrial Ethernet switches, and rail transit communication equipment, this temperature coverage reduces the need for additional derating in the design.

Practical Value of Backward Compatibility. This cage supports backward compatibility with 56G OSFP, meaning a seamless transition from the 400G/56G generation to the 112G/800G generation is possible on the same hardware platform, thereby reducing connector redesign costs during equipment upgrades.

IV. Three Key Points Often Overlooked During Selection

First, distinguish the procurement boundaries between the “cage” and the “connector body.” The UE62-F162G-020G1 is a cage assembly with a heat sink; the system board typically also requires a matching OSFP SMT connector body (such as the corresponding connector model in the UE62 series). When preparing the BOM, confirm whether the cage and connector are procured separately to avoid discovering missing parts after receipt.

Second, ensure the heat sink height matches the chassis airflow path. A height of 9.5 mm falls within the “low-profile range,” but not all chassis provide exactly the same clearance. During the selection phase, it is recommended to perform interference checks using actual 3D models of the chassis, paying particular attention to the gaps between heat sinks of adjacent ports and between the heat sink and the top cover. An increase or decrease of just 1–2 mm in heatsink height can affect assembly feasibility in dense port layouts.

Third, RoHS compliance and supply chain traceability. This model is marked as “RoHS Compliant.” When exporting to the EU or supplying customers with environmental compliance requirements, suppliers must provide the corresponding material declarations or batch compliance documents. Selecting distribution channels certified under an ISO quality management system can reduce risks related to incoming material consistency.

V. Mingjiada’s Supply Capability and Delivery Assurance

Founded in 1996, Mingjiada Electronics is an authorized independent distributor of electronic components. With branches in Shenzhen, Hong Kong, Japan, Russia, and Taiwan, the company has obtained ISO 9001 Quality Management System and ISO 14001 Environmental Management System certifications and specializes in distributing products from over 500 well-known manufacturers. For the Amphenol connector product line, Mingjiada has established long-term supply relationships with the original manufacturer, achieving comprehensive stock coverage for categories such as Amphenol high-speed connectors and card-edge connectors.

For the UE62-F162G-020G1, Mingjiada offers the following supply support: Genuine, original-manufacturer channels, with all batches traceable to the original manufacturer or authorized sources; Stock availability and short lead times—leveraging our domestic warehousing and logistics system, we maintain a stock of commonly used models for rapid shipment, alleviating pressure from urgent production line orders; small-batch and sample support, facilitating early verification during the R&D phase of the compatibility between the connector housing and PCB packaging, as well as heat sink clearance.

To confirm stock availability, request samples, or obtain bulk pricing, please contact the relevant sales representative at Mingjiada Electronics (www.integrated-ic.com) directly and provide your project quantity and delivery schedule requirements to receive tailored support.