Blog về công ty Acquisition Renesas Wireless Connectivity Evaluation Board:BLE,Wi-Fi MCU,Wi-Fi Networking

Acquisition Renesas Wireless Connectivity Evaluation Board:BLE,Wi-Fi MCU,Wi-Fi Networking

Shenzhen Mingjiada Electronics Co., Ltd. is an experienced electronic component recycler with a strong team, dedicated to helping customers reduce inventory, minimise storage space, and lower storage and management costs.

In the field of electronic component recycling, we offer the following core advantages:

Comprehensive coverage:

Supports the recycling of all types of electronic components, including integrated circuits (ICs), 5G chips, new energy ICs, IoT chips, Bluetooth chips, automotive chips, AI ICs, Ethernet ICs, memory chips, sensors, IGBT modules, and more.

High-Priced Recycling:

Offers competitive quotes 5%-30% above market average prices, with higher premiums for scarce models.

Global Logistics and Rapid Settlement:

With a warehouse network spanning Shenzhen, Hong Kong, North America, and Europe, we support global freight-collect logistics (DHL/UPS/SF Express) and local customs clearance services. Payment is completed within T+1 working days after inspection, with the entire process taking no more than 5 working days.

Flexible cooperation models:

We support various sources such as factory surplus stock, project leftover materials, and distributor unsold inventory. We offer solutions including bulk/mixed batch recycling and inventory exchange to meet diverse needs.

Core Analysis of Wireless Connectivity Technologies:

1. Cutting-edge Wi-Fi 6/6E and Bluetooth LE combination MCUs

The RA6W series, newly released in December 2025, represents Renesas' flagship offering in wireless connectivity, marking its formal entry into the high-performance, low-power Wi-Fi 6 market.

RA6W1 and RA6W2: The series comprises two MCUs. The RA6W1 is a dual-band Wi-Fi 6 MCU, while the RA6W2 integrates Bluetooth Low Energy technology with Wi-Fi 6 to form a combined solution. Both support dual-band operation at 2.4GHz and 5GHz, dynamically selecting the optimal band to ensure high-speed, stable connectivity in device-dense environments.

Ultra-low power design: Addressing the “always-on” requirements of IoT devices, this series incorporates Wi-Fi 6's key energy-saving feature—Target Wake Time (TWT)—enabling devices to enter deep sleep while maintaining cloud connectivity. Sleep mode power consumption ranges from 200nA to 4µA, remaining below 50µA even in Dormant Time Interval Mode 10 (DTIM10). This delivers ideal endurance for battery-powered sensors, smart locks, medical monitors and similar devices.

High Performance and Integration: Based on the Arm® Cortex®-M33 core with a clock speed up to 160MHz and 704KB SRAM, it integrates extensive communication interfaces and analogue peripherals. Capable of operating as a standalone IoT application processor without requiring an external MCU, it significantly simplifies system design and reduces material costs.

Security and Certification: Incorporates hardware security engines including AES-256 encryption, secure boot, and a true random number generator. The RA6W1 has obtained EU Radio Equipment Directive (RED) certification and completed Matter 1.4 protocol certification, ensuring cross-platform interoperability for smart home devices.

2. Professional-grade Bluetooth Low Energy (BLE) Solutions

For applications with extreme sensitivity to power consumption and size, Renesas offers a dedicated BLE product line.

Automotive-grade BLE SoC: DA14533: Launched in May 2025, this is Renesas' first Bluetooth Low Energy system-on-chip certified to AEC-Q100 Grade 2, specifically designed for automotive environments. With transmission and reception currents of just 3.1mA and 2.5mA respectively, and deep sleep current as low as 500nA, it is highly suitable for applications such as Tyre Pressure Monitoring Systems (TPMS) and keyless entry.

RL78/G1D BLE MCUs and Modules: Targeting broad industrial and consumer electronics markets, the RL78/G1D series delivers highly integrated 16-bit BLE solutions. Its evaluation modules (e.g., RY7011A0000DZ00) integrate antennas and RF circuits within a compact form factor, requiring minimal external components for operation and significantly accelerating prototype development.

3. Plug-and-play wireless combination modules

To maximise design simplicity, Renesas also offers pre-certified modular products.

DA16600MOD Pmod Module: This module integrates the ultra-low-power Wi-Fi DA16200 SoC and low-power Bluetooth DA14531 SoC, enabling straightforward Wi-Fi network configuration via Bluetooth LE. Featuring a standard Pmod interface, it connects rapidly like building blocks to Renesas' QuickConnect IoT platform or other compatible development boards, making it an invaluable tool for proof-of-concept and prototyping.